JNTC and TOPPAN Team Up on Glass Substrates for AI Chips — Semiconductor News, July 19, 2026
中文摘要
JNTC与TOPPAN将合作开发用于AI芯片的玻璃基板，预示着AI封装领域的新一轮竞争即将开启。
English Summary
JNTC and TOPPAN are partnering to develop glass substrates for AI chips, signaling a new competitive frontier in AI packaging technology.
原文节选
My take: TSMC is today’s king, but the glass-substrate throne is still empty — and that is where the next fight over AI packaging begins. Continue reading on Medium »